Hardware Board Design

Description

NewPhotonics is a fabless semiconductor engineering innovative optical-first silicon photonic product and technology for AI interconnect in data centers and hyperscaler infrastructure. Our market-disrupting PIC solutions enable energy efficiency, production simplicity and volume manufacturing of pluggable, NPO and CPO chips and engine platforms that will deliver compact-packaged optical connectivity in scale-out, scale-up and scale-across networks. Job Description We are looking for a Hardware Board Design to join our dynamic team and play a key role in shaping the technological landscape of our company. Our Hardware and Firmware group leads the development of electro-optical devices and systems for next-generation data centers. Main Responsibilities Actively participate in hands-on PCB design including schematics creation and layout work using industry standard EDA tools. Participate in the development of next-generation electro-optical devices and sub-systems for high-speed communication. Support electro-optic sub-systems and evaluation boards through schematic design, component selection, characterization, layout considerations, and implementation. Provide guidance on fabrication and assembly. Utilize advanced PCB technologies including mSAP, high-density HDI, and state-of-the-art PCB materials optimized for high-speed signal integrity supporting speeds up to 224 Gbps. Lead board bring-up, characterization, and debug, including high-speed scope and VNA measurements. Collaborate with hardware project teams, including Production, Software/Firmware, Photonics, and System. Support customers by reviewing schematics and PCB layouts, providing guidance to ensure robust design and high-speed performance. Utilize state-of-the-art laboratory equipment.

Requirements

• Qualifications & Requirements
• B.Sc. in Electrical Engineering or an equivalent technical discipline.
• 8+ years as a board designer with experience in executing complex hardware projects.
• Extensive experience designing high-speed PCBs, covering impedance control, length matching, and SI/PI best practices for standards such as Gigabit Ethernet and PCIe.
• Hands-on experience with Cadence tools (Allegro, OrCAD) for schematic capture and PCB layout.
• Experience in design ownership on major blocks/clusters from definition through implementation phases.
• Strong hands-on laboratory skills and debugging capabilities.
• Skilled in working with advanced PCB materials and high-density PCB technologies, including complex stackups and fine-pitch routing.
• Strong project management skills, independence, and excellent interpersonal abilities.
• Strong understanding of transmission lines, impedance control, crosstalk, and return-path design.
• Familiarity with lab equipment such as oscilloscopes, VNAs, and spectrum analysers.
• Star Candidate Advantages
• Proven proficiency in ANSYS HFSS / SIwave / 3D Layout for electromagnetic, SI, and PI simulations.
• Ability to interpret and simulate S-parameters, eye diagrams, and frequency-domain models.
• Experience in PCB design involving high-speed DSPs, including power integrity, signal-integrity constraints, and high-speed interface routing.
• Practical experience with high-speed sampling oscilloscopes and optical spectrum analysers.
• Experience with optical transceivers.
• Knowledge of photonic integration technology and its ecosystem.
• Experience in lab automation using Python-based tools.