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Signal Integrity Engineer

Newphotonics·Petah Tikva·Posted yesterday

Senior5+ yrsOn-site

Description

NewPhotonics is an award-winning fabless semiconductor company specializing in advanced silicon photonics and all-optical interconnect solutions for data centers and AI infrastructure. The company's core technology involves replacing power-hungry digital silicon chips with silicon photonic chips, aiming to improve performance and energy efficiency for AI clusters.

Job Description We are looking for a Signal Integrity Engineer to join our team, responsible for ensuring high-speed signal quality, optimization of complex PCB layouts, and advanced electromagnetic simulations for next-generation electro-optical systems.

Main Responsibilities Perform advanced electromagnetic (EM), Signal Integrity (SI), and Power Integrity (PI) simulations for high-speed boards and packages supporting speeds up to 224 Gbps. Collaborate closely with the Hardware Board Design team to define layout guidelines, stackups, and routing constraints for ultra-high-speed interfaces. Analyze S-parameters, eye diagrams, insertion loss, return loss, and frequency-domain models to mitigate crosstalk and signal degradation. Validate simulation models against lab measurements using high-speed oscilloscopes, VNAs, and TDR equipment. Define and optimize high-speed transmission lines, differential pairs, vias, and connector transitions.

Requirements

  • B.Sc. or M.Sc. in Electrical Engineering.
  • 5+ years of experience specializing in High-Speed Signal Integrity and Power Integrity engineering.
  • Proven hands-on expertise with industry-standard simulation tools such as ANSYS HFSS, SIwave, PowerSI, or Keysight ADS.
  • Deep theoretical and practical knowledge of transmission line theory, electromagnetic fields, S-parameters, and jitter analysis.
  • Experience with high-speed serial links (e.g., PCIe, Ethernet, SerDes) operating at tens of Gbps.
  • Strong correlation skills between simulation results and physical laboratory measurements.
  • Star Candidate Advantages
  • Experience with advanced packaging technologies, silicon photonics interfaces, and optical transceivers SI analysis.
  • Background in scripting (Python/MATLAB) for automating SI workflows and post-processing simulation data.
  • Familiarity with mSAP and high-density HDI manufacturing constraints.
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